Specifications
[No. 1]
Shimazu
3 targets (4 inch dia.)
2 RF power supplies
Base pressure: 3 x 10-5 Pa
Substrate cleaning system and substrate water cooling system
Substrate rotation system for the multilayer deposition[No. 2]
Shimazu
3 targets (4 inch dia.)
2 RF power supplies
Base pressure: 3 x 10-5 Pa
Substrate cleaning system and substrate water cooling system
Substrate rotation system (orbital and spin) for disk media fabrication
