Specifications
TPT HB10
Bonding modes: Wedge Bonding and Ball Bonding
Wire: Au (for Ball bonding) 17 µmΦ ~ 50 µmΦ
Al (for Wedge bonding) 17 µmΦ ~ 75 µmΦ
Heater stage: 90 mmΦ, ≦ 250 degC
Bonding area: 10 mm x 10 mm
Specifications
TPT HB10
Bonding modes: Wedge Bonding and Ball Bonding
Wire: Au (for Ball bonding) 17 µmΦ ~ 50 µmΦ
Al (for Wedge bonding) 17 µmΦ ~ 75 µmΦ
Heater stage: 90 mmΦ, ≦ 250 degC
Bonding area: 10 mm x 10 mm
 |
|
|
|
|
|
|
|
 |
|
||||||
 |
 |
 |
|
||||
 |
 |
 |
|
||||
 |
|
||||||
 |
 |
 |
|
||||
 |
|
||||||
 |
|
||||||
|
|
 |
|
 |
|
 |
|
 |
|
 |
|
 |
|
 |
|
 |
|
|
|
|
|
 |
 |
|
|